XR2C1011N related parameters_XR2C1011N PDF documentation_Omron Electronics Inc-EMC Div

Sockets for ICs Transistors

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Specifications

Description	Details
Series	XR2
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	10 (1 x 10)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Threaded
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C

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