4727 related parameters_4727 PDF documentation_Adafruit Industries LLC

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	SOIC
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	100.0µin (2.54µm)
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic
Operating Temperature	-

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