APF19-19-10CB related parameters_APF19-19-10CB PDF documentation_CTS Thermal Management Products

Thermal - Heat Sinks

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Specifications

Description	Details
Series	APF
Package	Box
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Fins
Length	0.748" (19.00mm)
Width	0.748" (19.00mm)
Diameter	-
Fin Height	0.370" (9.40mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	5.30°C/W @ 200 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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