109X6512A2016 related parameters_109X6512A2016 PDF documentation_Sanyo Denki America Inc.

Thermal - Heat Sinks

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Specifications

Description	Details
Series	San Ace MC
Package	Box
Type	Board Level
Package Cooled	Pentium® III (Thin)
Attachment Method	Clip
Shape	Rectangular
Length	2.520" (64.00mm)
Width	2.000" (50.80mm)
Diameter	-
Fin Height	1.220" (31.00mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	1.15°C/W
Thermal Resistance @ Natural	-
Material	Aluminum, Plastic
Material Finish	-

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