TMS5703137CGWTMEP related parameters_TMS5703137CGWTMEP PDF documentation_Texas Instruments

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Specifications

Description	Details
Series	Hercules™ TMS570 ARM® Cortex®-R
Package	Tray
Core Processor	ARM® Cortex®-R4F
Core Size	16/32-Bit
Speed	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals	DMA, POR, PWM, WDT
Number of I/O	120
Program Memory Size	3MB (3M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	256K x 8
Voltage - Supply (Vcc/Vdd)	1.14V ~ 1.32V
Data Converters	A/D 16x12b, 24x12b
Oscillator Type	External
Operating Temperature	-55°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package / Case	337-LFBGA
Supplier Device Package	337-NFBGA (16x16)

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