SPC5775EDK3MME3R related parameters_SPC5775EDK3MME3R PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	MPC57xx
Package	Tape & Reel (TR)
Core Processor	e200z7
Core Size	32-Bit Dual-Core
Speed	264MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, Zipwire
Number of I/O	293
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 40x12b eQADCx2
Oscillator Type	External
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package / Case	416-BGA
Supplier Device Package	416-MAPBGA (27x27)

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