SPC5777CLK3MMO3 related parameters_SPC5777CLK3MMO3 PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	MPC57xx
Package	Tray
Core Processor	e200z7
Core Size	32-Bit Tri-Core
Speed	264MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, Zipwire
Number of I/O	-
Program Memory Size	8MB (8M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 16b Sigma-Delta, eQADC
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package / Case	516-BGA
Supplier Device Package	516-MAPBGA (27x27)

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