MPC5775K-356DS598 related parameters_MPC5775K-356DS598 PDF documentation_Freescale Semiconductor

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Specifications

Description	Details
Series	Automotive, AEC-Q100 MPC57xx
Package	Bulk
Core Processor	e200z7260
Core Size	32-Bit Dual-Core
Speed	40MHz
Connectivity	CANbus, Ethernet, FlexRay, I²C, LINFlex, SIPI, SPI
Peripherals	DMA
Number of I/O	-
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	1.5M x 8
Voltage - Supply (Vcc/Vdd)	1.19V ~ 5.5V
Data Converters	A/D 37x12b SAR, 8x12b Sigma-Delta; D/A 1x12b
Oscillator Type	External, Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	356-LFBGA
Supplier Device Package	356-LFBGA (17x17)

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