MK30DX256ZVMD10 related parameters_MK30DX256ZVMD10 PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	Kinetis K30
Package	Tray
Core Processor	ARM® Cortex®-M4
Core Size	32-Bit
Speed	100MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	102
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
EEPROM Size	4K x 8
RAM Size	64K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V
Data Converters	A/D 46x16b; D/A 2x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	144-LBGA
Supplier Device Package	144-MAPBGA (13x13)

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