SAC57D53MCVMOR related parameters_SAC57D53MCVMOR PDF documentation_NXP USA Inc.

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Specifications

Description	Details
Series	MAC57Dxxx
Package	Tape & Reel (TR)
Core Processor	ARM® Cortex®-A5, -M4, -M0+
Core Size	32-Bit Tri-Core
Speed	80MHz, 160MHz, 320MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
Peripherals	DMA, LCD, LVD/HVD, POR, PWM, WDT
Number of I/O	-
Program Memory Size	3MB (3M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	2.3M x 8
Voltage - Supply (Vcc/Vdd)	3.15V ~ 5.5V
Data Converters	A/D 24x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	516-BGA
Supplier Device Package	516-MAPBGA (27x27)

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