XAZU3EG-L1SFVA625I related parameters_XAZU3EG-L1SFVA625I PDF documentation_Xilinx Inc.

System On Chip (SoC)

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Specifications

Description	Details
Series	Zynq® UltraScale+™ MPSoC EG
Package	Tray
Architecture	MPU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size	-
RAM Size	1.8MB
Peripherals	DMA, WDT
Connectivity	CANbus, I²C, SPI, UART/USART, USB
Speed	500MHz, 1.2GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	625-BFBGA, FCBGA
Supplier Device Package	625-FCBGA (21x21)

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