MMF006619 related parameters_MMF006619 PDF documentation_Micro-Measurements (Division of Vishay Precision Group)

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn63Pb36.65Sb0.35 (63/36.65/0.35)
Diameter	0.020" (0.51mm)
Melting Point	361°F (183°C)
Flux Type	Rosin Activated (RA)
Wire Gauge	24 AWG, 25 SWG
Process	Leaded
Form	Spool
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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