EXB-SN96AG4 related parameters_EXB-SN96AG4 PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	Super Low Dross™
Package	Bulk
Type	Bar Solder
Composition	Sn96Ag4 (96/4)
Diameter	-
Melting Point	430°F (221°C)
Flux Type	-
Wire Gauge	-
Process	Leaded
Form	Bar, 1 lb (454g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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