RASWLF.031 1LB related parameters_RASWLF.031 1LB PDF documentation_Chip Quik Inc.

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	0.031" (0.79mm)
Melting Point	422 ~ 428°F (217 ~ 220°C)
Flux Type	Rosin Activated (RA)
Wire Gauge	21 AWG, 20 SWG
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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