SMDSWLF.020 1LB related parameters_SMDSWLF.020 1LB PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Wire Solder
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	0.020" (0.51mm)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	No-Clean, Water Soluble
Wire Gauge	24 AWG, 25 SWG
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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