TS391LT related parameters_TS391LT PDF documentation_Chip Quik Inc.

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	281°F (138°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Syringe, 0.53 oz (15g), 5cc
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)

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